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Laser Induced Micro Plasma Processing of Polymer Substrates for Biomedical Implant Applications

French, PW and Rosowski, A and Murphy, MF and Irving, M and Sharp, MC (2015) Laser Induced Micro Plasma Processing of Polymer Substrates for Biomedical Implant Applications. In: Proceedings of the SPIE, Industrial Laser Applications Symposium (ILAS 2015) , 9657. (4th Industrial Laser Applications Symposium (ILAS), 17th - 18th March 2015, Kenilworth, ENGLAND).

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Abstract

This paper reports the experimental results of a new hybrid laser processing technique; Laser Induced Micro Plasma Processing (LIMP2). A transparent substrate is placed on top of a medium that will interact with the laser beam and create a plasma. The plasma and laser beam act in unison to ablate material and create micro-structuring on the “backside” of the substrate. We report the results of a series of experiments on a new laser processing technique that will use the same laser-plasma interaction to micromachining structures into glass and polymer substrates on the “topside” of the substrate and hence machine non-transparent material. This new laser processing technique is called Laser Induced Micro Plasma Processing (LIMP2). Micromachining of biomedical implants is proving an important enabling technology in controlling cell growth on a macro-scale. This paper discusses LIMP2 structuring of transparent substrate such as glasses and polymers for this application. Direct machining of these materials by lasers in the near infrared is at present impossible. Laser Induced Micro Plasma Processing (LIMP2) is a technique that allows laser operating at 1064 nm to machine microstructures directly these transparent substrates. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

Item Type: Conference or Workshop Item (Paper)
Additional Information: Copyright 2015 Society of Photo Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
Uncontrolled Keywords: Science & Technology; Technology; Physical Sciences; Engineering, Electrical & Electronic; Optics; Physics, Applied; Engineering; Physics; ASSISTED ABLATION; FUSED-SILICA; ETCHING TECHNIQUE; MICROFABRICATION; GLASS
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TK Electrical engineering. Electronics. Nuclear engineering
Divisions: General Engineering Research Institute
Publisher: SPIE
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Date Deposited: 11 Nov 2015 14:04
Last Modified: 11 Nov 2015 14:04
DOI or Identification number: 10.1117/12.2180231
Editors: Green, M
URI: http://researchonline.ljmu.ac.uk/id/eprint/1905

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