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Molecular Dynamics (MD) Simulation of Multi-pass Nanometric Machining – The Effect of Machining Conditions

Chen, X and Oluwajobi, AO (2016) Molecular Dynamics (MD) Simulation of Multi-pass Nanometric Machining – The Effect of Machining Conditions. Current Nanoscience, 12. ISSN 1573-4137

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Abstract

Understanding material behaviour during nanoscale machining is critical for improving machining efficiency. This paper investigates the benefits of using Molecular Dynamics (MD) simulation in studying the effects of machining parameters in nanometric machining of copper workpiece with a diamond tool. The material behaviour under multi cutting pass conditions was examined. The copper-copper interactions were modelled by the EAM potential and the copper-diamond interactions were modelled by the Morse potential. The diamond tool was modelled as a deformable body and the Tersoff potential was applied for the carbon-carbon interactions. It was observed that the average tangential and normal components of the cutting forces increase with increase in depth of cut and they reduced in consecutive cutting passes for each depth of cut. The ratios of the tangential to the normal force components decreases as the depth of cut increases, but remain constant after the depth of cut 1.5nm. The magnitudes of the cutting forces decrease from pass 1 to pass 2, but they are identical for both pass 2 and pass 3. The least resistance to cutting was observed at 2.0nm, which may indicate the existence of a critical depth of cut in nanomachining, for tool wear reduction. After the first pass, the average tangential and normal components of the cutting forces increase with increase in the feed. Also, there is always an increase in friction from pass 1 to pass 2. In multipass processes, the arrangement should be effected with minimum overlap in the runs, for efficient machining.

Item Type: Article
Uncontrolled Keywords: 1007 Nanotechnology
Subjects: Q Science > QA Mathematics > QA76 Computer software
T Technology > T Technology (General)
Divisions: Electronics and Electrical Engineering
Publisher: Bentham Science Publishers
Date Deposited: 13 Jul 2016 13:23
Last Modified: 13 Jul 2016 13:23
DOI or Identification number: 10.2174/1573413712666160530123245
URI: http://researchonline.ljmu.ac.uk/id/eprint/3888

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