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Measurement of 3D Ultrasonic Wavefield Using Pulsed Laser Holographic Microscopy for Ultrasonic Nondestructive Evaluation

Zhang, G, Wang, X, Ma, H-W, Zhang, Y and Wang, D Measurement of 3D Ultrasonic Wavefield Using Pulsed Laser Holographic Microscopy for Ultrasonic Nondestructive Evaluation. Sensors. ISSN 1424-2818 (Accepted)

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Abstract

In ultrasonic array imaging, 3D ultrasonic wavefields are normally recorded by an ultrasonic piezo array transducer. Its performance is limited by the configuration and size of the array transducer. In this paper, a method based on digital holographic interferometry is proposed to record the 3D ultrasonic wavefields instead of the array transducer, and the measurement system consisting of a pulsed laser, ultrasonic excitation, and synchronization and control circuit is designed. A consecutive sequence of holograms of ultrasonic wavefields are recorded by the system. The interferograms are calculated from the recorded holograms at different time sequence. The amplitudes and phases of the transient ultrasonic wavefields are recovered from the interferograms by phase unwrapping. The consecutive sequence of transient ultrasonic wavefields are stacked together to generate 3D ultrasonic wavefields. Simulation and experiments are carried out to verify the proposed technique, and preliminary results are presented.

Item Type: Article
Uncontrolled Keywords: 0301 Analytical Chemistry, 0906 Electrical And Electronic Engineering
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TK Electrical engineering. Electronics. Nuclear engineering
Divisions: General Engineering Research Institute
Publisher: MDPI AG
Date Deposited: 12 Feb 2018 12:36
Last Modified: 12 Feb 2018 12:36
URI: http://researchonline.ljmu.ac.uk/id/eprint/8000

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