Items where Author is "Lee, C"
 | Up a level |
Article
Slates, S, Cook-Sather, A, Aghakhani, S, Al-Humuzi, A, Alonso, D, Borgstrom, K, Boyle, F, Cachia, C, Carlson, E, Cole, J, Dennehy, T, Väfors Fritz, M, Gadzirayi, M, Goff, L, Gudmundsoon, P, Han, Y, Hellman, P, Holder, K, Hou, S, Hughes, J , Jennings, J, Jegliska, W, Kaur, A, Kehan, L, Kelly, A, Lee, C, Leonard, C, Lewitzky, R, Majeed, A, Marquart, M, Marsden, J, Marshall, L, Matu, F, Molefe, T, Mori, Y, Morrell-Scott, N, Mullenger, E, Obregon, M, Pearce, M, Pike, C, Pol, H, Riva, E, Sands, C, Sinanan, R, Smart, K, Smeltzer, S, Spence, A, Maggard Stephens, T, Stollenwerk, M, Sum, K, Van-Ess, J, Vick, D, Wong, M, Wright, H, Wright, J and Zou, W (2023) How can students-as-partners work address challenges to student, faculty, and staff mental health and well-being? International Journal for Students as Partners, 7 (2). pp. 221-240.
Richardson, SJ, McRobert, AP, Vinson, D, Cronin, CJ, Lee, C and Roberts, SJ (2023) Systematic review of sport coaches’ and teachers’ perceptions and application of game-based and constraints-led pedagogy: A qualitative meta-study. Quest. pp. 1-22. ISSN 0033-6297
Lee, C, Jessop, A, Bidgood, A, Peter, MS, Pine, JM, Rowland, CF and Durrant, S (2023) How executive functioning, sentence processing, and vocabulary are related at 3 years of age. Journal of Experimental Child Psychology, 233. ISSN 0022-0965
Zhang, G, Lee, C, Harvey, D and Qi, A (2016) Characterization of Micro-Crack Propagation through Analysis of Edge Effect in Acoustic Micro Imaging of Microelectronic Packages. NDT & E International, 79. pp. 1-6. ISSN 1879-1174
Zhang, G, Lee, C, Harvey, DM, Ma, HW and Braden, D (2016) Finite Element Modelling for the Investigation of Edge Effect in Acoustic Micro Imaging of Microelectronic Packages. Measurement Science and Technology, 27 (2). ISSN 1361-6501
Zhang, G, Lee, C, Harvey, D and Ma, H (2015) Development of C-Line plot technique for characterization of edge effects in acoustic imaging: A case study using flip chip package geometry. Microelectronics Reliability. ISSN 1872-941X