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Ogbomo, OO, Amalu, EH, Ekere, NN and Olagbegi, PO (2017) Effect of Coefficient of Thermal Expansion (CTE) Mismatch of Solder Joint Materials in Photovoltaic (PV) Modules Operating in Elevated Temperature Climate on the Joint's Damage. Procedia Manufacturing, 11. pp. 1145-1152. ISSN 2351-9789
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Effect of Coefficient of Thermal Expansion (CTE) Mismatch of Solder Joint Materials in Photovoltaic (PV) Modules.pdf - Published Version Available under License Creative Commons Attribution Non-commercial No Derivatives. Download (1MB) | Preview |
Abstract
With failure of solder joints (SJs) in photovoltaic (PV) modules constituting over 40% of the total module failures, investigation of SJ's reliability factors is critical. This study employs the Garofalo creep model in ANSYS Finite Element Modelling (FEM) to simulate solder joint damage. Accumulated creep strain energy density is used to quantify damage. PV modules consisting of interconnections formed from different material combinations (silver, copper, aluminum, zinc, tin and brass) are subjected to induced temperature cycles ranging from -40 °C to +85 °C. Results show that zinc-solder-silver joint having the highest CTE mismatch of 19.6 ppm exhibits the greatest damage while silver-solder-silver with no mismatch possesses the least damage.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | 0910 Manufacturing Engineering, 1007 Nanotechnology |
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) |
| Divisions: | Engineering |
| Publisher: | Elsevier |
| Date Deposited: | 02 Nov 2021 11:51 |
| Last Modified: | 02 Nov 2021 12:00 |
| DOI or ID number: | 10.1016/j.promfg.2017.07.236 |
| URI: | https://researchonline.ljmu.ac.uk/id/eprint/15729 |
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