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Laser Induced Micro Plasma Processing of Polymer Substrates for Biomedical Implant Applications

French, PW, Rosowski, A, Murphy, M, Irving, M and Sharp, MC (2015) Laser Induced Micro Plasma Processing of Polymer Substrates for Biomedical Implant Applications. In: Proceedings of the SPIE, Industrial Laser Applications Symposium (ILAS 2015) , 9657. (4th Industrial Laser Applications Symposium (ILAS), 17 March 2015 - 18 March 2015, Kenilworth, ENGLAND).

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This paper reports the experimental results of a new hybrid laser processing technique; Laser Induced Micro Plasma Processing (LIMP2). A transparent substrate is placed on top of a medium that will interact with the laser beam and
create a plasma. The plasma and laser beam act in unison to ablate material and create micro-structuring on the “backside” of the substrate. We report the results of a series of experiments on a new laser processing technique that will use the same laser-plasma interaction to micromachining structures into glass and polymer substrates on the “topside” of the substrate and hence machine non-transparent material. This new laser processing technique is called Laser Induced Micro Plasma Processing (LIMP2).
Micromachining of biomedical implants is proving an important enabling technology in controlling cell growth on a macro-scale. This paper discusses LIMP2 structuring of transparent substrate such as glasses and polymers for this
application. Direct machining of these materials by lasers in the near infrared is at present impossible. Laser Induced
Micro Plasma Processing (LIMP2) is a technique that allows laser operating at 1064 nm to machine microstructures
directly these transparent substrates.

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: Science & Technology; Technology; Physical Sciences; Engineering, Electrical & Electronic; Optics; Physics, Applied; Engineering; Physics; ASSISTED ABLATION; FUSED-SILICA; ETCHING TECHNIQUE; MICROFABRICATION; GLASS
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TK Electrical engineering. Electronics. Nuclear engineering
Divisions: Engineering
Publisher: Society of Photo-Optical Instrumentation Engineers
Related URLs:
Date Deposited: 11 Aug 2015 09:52
Last Modified: 13 Apr 2022 15:13
DOI or ID number: 10.1117/12.2180231
Editors: Green, M
URI: https://researchonline.ljmu.ac.uk/id/eprint/1820

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