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Zhang, G, Lee, C, Harvey, D and Ma, H (2015) Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry. Microelectronics Reliability. ISSN 1872-941X
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Abstract
Edge effect is a common phenomenon observed in acoustic micro-imaging of microelectronic packages. In this paper, using flip chip package geometry as a test vehicle, finite element modelling is carried out to study the fundamental mechanism of the edge effect phenomenon. C-Line plot technique is developed for the characterization of edge effects in acoustic C-scan images, in particular solder joint C-scan images. Simulated results are compared to experimental results. Results reveal that edge effect generation is mainly attributed to the under-bump-metallisation structure. In addition, through analysis of the C-Line profile of edge effects, the impact of the transducer focal point and the spot size on the edge effect is investigated. Results show that slight off-focus can reduce the severity of the edge effect in which image sharpness is a trade-off.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | 0906 Electrical And Electronic Engineering |
| Subjects: | T Technology > TP Chemical technology |
| Divisions: | Engineering |
| Publisher: | Elsevier |
| Date Deposited: | 11 Sep 2015 11:08 |
| Last Modified: | 04 Sep 2021 13:59 |
| DOI or ID number: | 10.1016/j.microrel.2015.08.005 |
| URI: | https://researchonline.ljmu.ac.uk/id/eprint/1980 |
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- Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry. (deposited 11 Sep 2015 11:08) [Currently Displayed]
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