Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys

Kotadia, HR, Mannan, SH and Das, A (2019) Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys. Journal of Electronic Materials, 48 (5). pp. 2731-2736. ISSN 0361-5235

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Abstract

In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging for up to 1000 h at 150°C. Thermodynamically stable intermetallics (IMCs) Cu-Zn and Cu-Sn formed at the interface depending on the solder composition. Formation of different interfacial IMCs during soldering and after prolonged aging is explained by the spalling mechanism that resulted from the depletion of Zn from the solder matrix.

Item Type:	Article
Uncontrolled Keywords:	0202 Atomic, Molecular, Nuclear, Particle and Plasma Physics; 0906 Electrical and Electronic Engineering; 1099 Other Technology; Applied Physics
Subjects:	T Technology > TA Engineering (General). Civil engineering (General)
Divisions:	Engineering
Publisher:	Springer Science and Business Media LLC
Date of acceptance:	8 January 2019
Date of first compliant Open Access:	27 January 2025
Date Deposited:	27 Jan 2025 12:48
Last Modified:	27 Jan 2025 13:00
DOI or ID number:	10.1007/s11664-019-06941-0
URI:	https://researchonline.ljmu.ac.uk/id/eprint/25438

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