Lee, Chean Shen (2014) Numerical Study For Acoustic Micro-Imaging Of Three Dimensional Microelectronic Packages. Doctoral thesis, Liverpool John Moores University.

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Abstract

Complex structures and multiple interfaces of modern microelectronic packages complicate the interpretation of acoustic data. This study has four novel contributions. 1) Contributions to the finite element method. 2) Novel approaches to reduce computational cost. 3) New post processing technologies to interpret the simulation data. 4) Formation of theoretical guidance for acoustic image interpretation. The impact of simulation resolution on the numerical dispersion error and the exploration of quadrilateral infinite boundaries make up the first part of this thesis's contributions. The former focuses on establishing the convergence score of varying resolution densities in the time and spatial domain against a very high fidelity numerical solution. The latter evaluates the configuration of quadrilateral infinite boundaries in comparison against traditional circular infinite boundaries and quadrilateral Perfectly Matched Layers. The second part of this study features the modelling of a flip chip with a 140µm solder bump assembly, which is implemented with a 230MHz virtual raster scanning transducer with a spot size of 17µm. The Virtual Transducer was designed to reduce the total numerical elements from hundreds of millions to hundreds of thousands. Thirdly, two techniques are invented to analyze and evaluate simulated acoustic data: 1) The C-Line plot is a 2D max plot of specific gate interfaces that allows quantitative characterization of acoustic phenomena. 2) The Acoustic Propagation Map, contour maps an overall summary of intra sample wave propagation across the time domain in one image. Lastly, combining all the developments. The physical mechanics of edge effects was studied and verified against experimental data. A direct relationship between transducer spot size and edge effect severity was established. At regions with edge effect, the acoustic pulse interfacing with the solder bump edge is scattered mainly along the horizontal axis. The edge effect did not manifest in solder bump models without Under Bump Metallization (UBM). Measurements found acoustic penetration improvements of up to 44% with the removal of (UBM). Other acoustic mechanisms were also discovered and explored. Defect detection mechanism was investigated by modelling crack propagation in the solder bump assembly. Gradual progression of the crack was found have a predictable influence on the edge effect profile. By exploiting this feature, the progress of crack propagation from experimental data can be interpreted by evaluating the C-Scan image.

Item Type:	Thesis (Doctoral)
Uncontrolled Keywords:	numerical, modelling, finite, element, analysis, solder, bump, under, metallization, virtual, transducer, high, frequency, C-Line, CLINE, acoustic, propagation, map, ultrasound, numerical, dispersion, error
Subjects:	T Technology > TK Electrical engineering. Electronics. Nuclear engineering
Divisions:	Engineering
Date Deposited:	18 Oct 2016 13:56
Last Modified:	03 Sep 2021 23:26
DOI or ID number:	10.24377/LJMU.t.00004502
Supervisors:	Zhang, GuangMing and Harvey, David
URI:	https://researchonline.ljmu.ac.uk/id/eprint/4502

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