Baishya, K, Harvey, DM, Partida Manzanera, T, Zhang, G and Braden, DR (2022) Failure patterns of solder joints identified through lifetime vibration tests. Nondestructive Testing and Evaluation. pp. 1-25. ISSN 1058-9759

Baishya, K, Harvey, DM, Zhang, G and Braden, DR (2020) Investigation into how the floor plan layout of a manufactured PCB influences flip-chip susceptibility to vibration. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (5). pp. 741-748. ISSN 2156-3950

Baishya, K (2019) Through-Life Monitoring of the impact of vibration on the reliability of area array packages using Non- Destructive Testing. Doctoral thesis, Liverpool John Moores University.

Harvey, DM, Zhang, GM, Baishya, K and Braden, DR (2016) Toolbox for 3D Imaging of Manufactured Electronic Circuits. In: IEEE ESTC 2016, 13 September 2016 - 16 September 2016, Grenoble France. (Unpublished)