Article

Baishya, K, Harvey, DM, Partida Manzanera, T, Zhang, G and Braden, DR (2022) Failure patterns of solder joints identified through lifetime vibration tests. Nondestructive Testing and Evaluation. pp. 1-25. ISSN 1058-9759

Mohamad Zaimi, NS, Mohd Salleh, MAA, Abdullah, MMAB, Ahmad, R, Mostapha, M, Yoriya, S, Chaiprapa, J, Zhang, G and Harvey, DM (2020) Effect of kaolin geopolymer ceramic addition on the properties of Sn-3.0Ag-0.5Cu solder joint. Materials Today Communications, 25. ISSN 2352-4928

Baishya, K, Harvey, DM, Zhang, G and Braden, DR (2020) Investigation into how the floor plan layout of a manufactured PCB influences flip-chip susceptibility to vibration. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (5). pp. 741-748. ISSN 2156-3950

Zhang, G, Lee, C, Harvey, DM, Ma, HW and Braden, D (2016) Finite Element Modelling for the Investigation of Edge Effect in Acoustic Micro Imaging of Microelectronic Packages. Measurement Science and Technology, 27 (2). ISSN 1361-6501

Deng, W, Zhang, G, Murphy, MF, Lilley, F, Harvey, DM and Burton, DR (2015) Analysis of dynamic cantilever behavior in tapping mode atomic force microscopy. Microscopy Research and Technique, 78 (10). pp. 935-946. ISSN 1097-0029

Conference or Workshop Item

Harvey, DM, Zhang, GM, Baishya, K and Braden, DR (2016) Toolbox for 3D Imaging of Manufactured Electronic Circuits. In: IEEE ESTC 2016, 13 September 2016 - 16 September 2016, Grenoble France. (Unpublished)