Zhang, G, Lee, C, Harvey, D and Ma, H (2015) Development of C-Line plot technique for characterization of edge effects in acoustic imaging: A case study using flip chip package geometry. Microelectronics Reliability. ISSN 1872-941X

Preview

Text Cline%20methodlogy_R2[1].pdf - Accepted Version Available under License Creative Commons Attribution Non-commercial No Derivatives. Download (1MB) | Preview

Abstract

Edge effect is a common phenomenon observed in Acoustic micro imaging of microelectronic packages. In this paper, using flip chip package geometry as a test vehicle, finite element modelling is carried out to study the fundamental mechanism of the edge effect phenomenon. C-line plot technique is developed for characterisation of edge effects in acoustic C-scan images, in particular solder joint C-scan images. Simulated results are compared to experimental results. Results reveal that edge effect generation is mainly attributed to the under-bump-metallisation structure. In addition, through analysis of the C-Line profile of edge effects, the impact of the transducer focal point and the spot size on the edge effect is investigated. Results show that slight off-focus can reduce the severity of the edge effect in which image sharpness is a trade-off.

Item Type:	Article
Uncontrolled Keywords:	0906 Electrical And Electronic Engineering
Subjects:	T Technology > TP Chemical technology
Divisions:	Engineering
Publisher:	Elsevier
Date Deposited:	13 Nov 2015 08:54
Last Modified:	09 Mar 2022 09:36
DOI or ID number:	10.1016/j.microrel.2015.08.005
URI:	https://researchonline.ljmu.ac.uk/id/eprint/1990

Available Versions of this Item

• Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry. (deposited 11 Sep 2015 11:08)
  • Development of C-Line plot technique for characterization of edge effects in acoustic imaging: A case study using flip chip package geometry. (deposited 13 Nov 2015 08:54) [Currently Displayed]

View Item