Mohan, N, Ahuir-Torres, JI, Kotadia, HR and Elger, G (2025) Laser sintering of Cu particle-free inks for high-performance printed electronics. npj Flexible Electron, 9 (1). pp. 1-10. ISSN 2397-4621

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Abstract

This study investigates laser sintering of Cu particle-free ink (Cu formate tetrahydrate—amino-2-propanol complex) as an alternative to conventional sintering in an oven (under inert/reducing atmosphere). Utilizing benefits of high-speed localized heating using laser, substrate damage can be prevented for low-melting substrates such as Polyethylene Terephthalate (PET). Firstly, a suitable sintering process window is achieved based on energy density for two different flexible polymeric susbtrates: Polyimide and PET using different laser parameters (laser power, scan rate and spot diameter). Subsequently, characterization of laser sintered traces are also made using different laser optic profiles (Gaussian and top hat). Different methodologies for fabrication of metallized Cu layer were also demonstrated. A very low bulk resistivity of 3.24 µΩcm (1.87 times of bulk Cu) was achieved on trace thickness of 0.85 ± 0.15 µm exhibiting good adherence to polymeric substrates. A promising fabrication process of low-cost and reliable flexible printed electronic devices is demonstrated.

Item Type:	Article
Uncontrolled Keywords:	4014 Manufacturing Engineering; 40 Engineering; 3403 Macromolecular and materials chemistry; 4009 Electronics, sensors and digital hardware; 4016 Materials engineering
Subjects:	T Technology > TA Engineering (General). Civil engineering (General)
Divisions:	Engineering
Publisher:	Springer Nature
SWORD Depositor:	A Symplectic
Date Deposited:	13 Mar 2025 13:27
Last Modified:	13 Mar 2025 13:30
DOI or ID number:	10.1038/s41528-025-00389-5
URI:	https://researchonline.ljmu.ac.uk/id/eprint/25889

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