The integration of optical interconnections on ceramic substrates

Guzowski, B, Rosowski, A, Lisik, Z, Jakubowska, M and Sharp, MC (2016) The integration of optical interconnections on ceramic substrates. Microelectronic Engineering, 157. pp. 19-23. ISSN 0167-9317

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Abstract

High heat conductivity and high heat capacity make ceramic substrates indispensable to the manufacture of Multi-Chip Modules (MCM) and power electronics. In this paper a detailed description of the integration process of optical lines on to ceramic substrates is presented. The manufacturing of microgrooves in ceramic substrates and the process of integration of optical fibres and active elements is described. Coupling active elements to optical fibre is also presented. Through such an integrated optical line a 4 Gbps signal was transmitted. © 2016 Elsevier B.V. All rights reserved.

Item Type:	Article
Uncontrolled Keywords:	0906 Electrical And Electronic Engineering
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) T Technology > TK Electrical engineering. Electronics. Nuclear engineering
Divisions:	Engineering
Publisher:	Elsevier
Date of acceptance:	15 February 2016
Date of first compliant Open Access:	1 May 2018
Date Deposited:	20 Sep 2016 10:58
Last Modified:	04 Sep 2021 12:30
DOI or ID number:	10.1016/j.mee.2016.02.021
URI:	https://researchonline.ljmu.ac.uk/id/eprint/4177

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