Toolbox for 3D Imaging of Manufactured Electronic Circuits

Harvey, DM, Zhang, GM, Baishya, K and Braden, DR (2016) Toolbox for 3D Imaging of Manufactured Electronic Circuits. In: IEEE ESTC 2016, 13 September 2016 - 16 September 2016, Grenoble France. (Unpublished)

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Item Type:	Conference or Workshop Item (Paper)
Subjects:	T Technology > TK Electrical engineering. Electronics. Nuclear engineering
Divisions:	Engineering
Publisher:	IEEE
Date of acceptance:	13 April 2016
Date of first compliant Open Access:	28 November 2016
Date Deposited:	28 Nov 2016 10:22
Last Modified:	13 Apr 2022 15:14
URI:	https://researchonline.ljmu.ac.uk/id/eprint/4793

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