Zhang, G and Lee, C and Harvey, D and Ma, H (2015) Development of C-Line plot technique for characterization of edge effects in acoustic imaging: A case study using flip chip package geometry. Microelectronics Reliability. ISSN 1872-941X
This is the latest version of this item.
Cline%20methodlogy_R2.pdf - Accepted Version
Available under License Creative Commons Attribution Non-commercial No Derivatives.
Edge effect is a common phenomenon observed in Acoustic micro imaging of microelectronic packages. In this paper, using flip chip package geometry as a test vehicle, finite element modelling is carried out to study the fundamental mechanism of the edge effect phenomenon. C-line plot technique is developed for characterisation of edge effects in acoustic C-scan images, in particular solder joint C-scan images. Simulated results are compared to experimental results. Results reveal that edge effect generation is mainly attributed to the under-bump-metallisation structure. In addition, through analysis of the C-Line profile of edge effects, the impact of the transducer focal point and the spot size on the edge effect is investigated. Results show that slight off-focus can reduce the severity of the edge effect in which image sharpness is a trade-off.
|Uncontrolled Keywords:||0906 Electrical And Electronic Engineering|
|Subjects:||T Technology > TP Chemical technology|
|Divisions:||General Engineering Research Institute|
|Date Deposited:||13 Nov 2015 08:54|
|Last Modified:||21 Aug 2016 23:50|
|DOI or Identification number:||10.1016/j.microrel.2015.08.005|
Available Versions of this Item
Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry. (deposited 11 Sep 2015 11:08)
- Development of C-Line plot technique for characterization of edge effects in acoustic imaging: A case study using flip chip package geometry. (deposited 13 Nov 2015 08:54) [Currently Displayed]
Actions (login required)