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Development of C-Line plot technique for characterization of edge effects in acoustic imaging: A case study using flip chip package geometry

Zhang, G and Lee, C and Harvey, D and Ma, H (2015) Development of C-Line plot technique for characterization of edge effects in acoustic imaging: A case study using flip chip package geometry. Microelectronics Reliability. ISSN 1872-941X

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Abstract

Edge effect is a common phenomenon observed in Acoustic micro imaging of microelectronic packages. In this paper, using flip chip package geometry as a test vehicle, finite element modelling is carried out to study the fundamental mechanism of the edge effect phenomenon. C-line plot technique is developed for characterisation of edge effects in acoustic C-scan images, in particular solder joint C-scan images. Simulated results are compared to experimental results. Results reveal that edge effect generation is mainly attributed to the under-bump-metallisation structure. In addition, through analysis of the C-Line profile of edge effects, the impact of the transducer focal point and the spot size on the edge effect is investigated. Results show that slight off-focus can reduce the severity of the edge effect in which image sharpness is a trade-off.

Item Type: Article
Uncontrolled Keywords: 0906 Electrical And Electronic Engineering
Subjects: T Technology > TP Chemical technology
Divisions: General Engineering Research Institute
Publisher: Elsevier
Date Deposited: 13 Nov 2015 08:54
Last Modified: 07 Sep 2017 06:34
DOI or Identification number: 10.1016/j.microrel.2015.08.005
URI: http://researchonline.ljmu.ac.uk/id/eprint/1990

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