Song, R, Richard, G, Cheng, CY-Y, Teng, L, Qiu, Y, Lavery, MPJ, Trolier-McKinstry, S, Cochran, S and Underwood, I (2019) Multi-Channel Signal Generator ASIC for Acoustic Holograms. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control. ISSN 0885-3010
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Abstract
A CMOS application-specific integrated circuit (ASIC) has been developed to generate arbitrary, dynamic phase patterns for acoustic hologram applications. An experimental prototype has been fabricated to demonstrate phase shaping. It comprises a cascadable 1 × 9 array of identical, independently-controlled signal generators implemented in a 0.35 μ m minimum feature size process. It can individually control the phase of a square wave on each of the nine output pads. The footprint of the integrated circuit is 1175 × 88 μ m2. A 128 MHz clock frequency is used to produce outputs at 8 MHz with phase resolution of 16 levels (4-bit) per channel. A 6 × 6 air-coupled matrix array ultrasonic transducer was built and driven by four ASICs, with the help of commercial buffer amplifiers, for the application demonstration. Acoustic pressure mapping and particle manipulation were performed. Additionally, a 2 × 2 array piezoelectric micromachined ultrasonic transducer (PMUT) was connected and driven by four output channels of a single ASIC, demonstrating the flexibility of the ASIC to work with different transducers and the potential for direct integration of CMOS and PMUTs.
Item Type: | Article |
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Additional Information: | © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
Uncontrolled Keywords: | 02 Physical Sciences, 09 Engineering |
Subjects: | T Technology > TK Electrical engineering. Electronics. Nuclear engineering |
Divisions: | Electronics & Electrical Engineering (merged with Engineering 10 Aug 20) |
Publisher: | Institute of Electrical and Electronics Engineers (IEEE) |
Date Deposited: | 06 Sep 2019 10:02 |
Last Modified: | 04 Sep 2021 08:54 |
DOI or ID number: | 10.1109/tuffc.2019.2938917 |
URI: | https://researchonline.ljmu.ac.uk/id/eprint/11311 |
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